Features: Reduce the temperature of the memory module by up to 35%. High conductivity thermal pad. Great for high performance and overclocked systems. Easily installs with the rovided spring clips.
Specifications: High performance, high temperature formulation. Temperature resistance up to 400F/minutes. Allows for overclocking memory.
High performance, high temperature formulation
Temperature resistance up to 400F/minutes
Allows for overclocking memory
References: Logisys Company Website
This product was added to our catalog on .
